IEC 60749-20 pdf download SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat 1 scope and object This part of lEC 60749 applies to semiconductor devices (discrete devices and integratedcircuits). This test method provides a means of assessing the resistance to soldering heat of plastic-encapsulated...